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Detailed Capabilities

Printed Circuit Board Manufacturing Capabilities

Listed below are Sunstone's printed circuit board assembly and PCB manufacturing capabilities. Our PCB production process provides you with everything you need to design and produce high-quality printed circuit boards.

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Detailed Printed Circuit Board Assembly Capabilities

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Detailed Capabilities

Inner Layers

MATERIAL TYPE, COPPER WEIGHT AND PCB DESIGN MAY LIMIT TRACE AND SPACE CAPABILITIES

LAYERS	Limited Review	Online NRE	Custom
Copper Weight (oz/sq ft) pre-plate
< 0.5 oz Cu	No	No	Yes*
0.5 oz Cu	No	No	Yes
1 oz Cu	Yes	Yes	Yes
2 oz Cu	Yes	Yes	Yes
3 oz Cu	No	No	Yes*
> 3 oz Cu	No	No	Yes*
*Material availability may impact lead time
Minimum trace/space INNER.
>3oz Cu	-	-	RFQ
< 0.5 oz Cu	N/A		RFQ
0.5 oz Cu		0.003"	0.003" / 0.003"*
1 oz Cu	0.005"	0.004/0.004"	0.003" / 0.003"
2 oz Cu	0.005"	0.005"/0.005"	0.004" / 0.004"
> 3.0 OZ Cu	N/A	N/A	0.007" / 0.007"*
*Material availability may impact lead time
Minimum clearance and pads INNER
Clearances - Through Hole Drill	0.020" larger than finished hole size	0.020" larger than finished hole size	0.020" larger than finished hole size
Clearances - Plated Slots	0.020" larger than finished slot dimension	0.020" larger than finished slot dimension	0.020" larger than finished slot dimension
Pads - Through Hole Drill	0.016" larger than finished hole size	0.016" larger than finished hole size	0.016" larger than finished hole size
Pads for Vias	0.010" larger than finished hole size	0.010" larger than finished hole size	0.010" larger than finished hole size
Pads Plated Slots	0.016" larger than finished slot dimension	0.016" larger than finished slot dimension	0.016" larger than finished slot dimension
Minimum backset (distance from copper feature to route/cut-line)	0.020"	0.010"	0.010"
Trace width variation (Non Impedance)	+/- 20%	+/- 20%	+/- 10%

Outer Layers

MATERIAL TYPE, COPPER WEIGHT AND PCB DESIGN MAY LIMIT TRACE AND SPACE CAPABILITIES

OUTER LAYERS	Limited Review	Online NRE	Custom
Copper Weight finished Cu weight
< 1.0 oz Cu	No	No	Yes*
1 oz Cu	Yes	Yes	Yes
2 oz Cu	Yes	Yes	Yes
3 oz Cu	Yes	Yes	Yes
> 3 oz Cu	No	No	Yes*

*Material availability may impact lead time
Minimum trace/space
< 1.0 oz Cu	N/A	NA	RFQ
1 oz Cu	0.004" / 0.004"	0.004" / 0.004"	0.003" / 0.003"
2 oz Cu	0.005" / 0.005"	0.005" / 0.005"	0.004" / 0.004"
3 oz Cu	0.007" / 0.007"	0.007" / 0.007"	0.006" / 0.006"
> 3 oz Cu	N/A	N/A	RFQ
Minimum clearance and pads

Through Hole Drill	0.016" larger than finished hole size	0.016" larger than finished hole size	< 0.016" larger than finished hole size
Via Pads	0.010" larger than drilled hole size	0.010" larger than drilled hole size	0.010" larger than drilled hole size
Minimum backset (distance from copper to board edge)	0.020"	0.010"	0.010"
Trace width variation	20%	20%	+/- 0.001" (plated features) +/- 0.0005" (non-plated layers)
Layer to layer registration variation	+/- 0.005" /layer	+/-0.005" / layer	+/- 0.005" /layer

Board thickness available
<0.01"	No	No*	Yes*
0.01"	No	No*	Yes
0.02"	Yes	Yes	Yes
0.031"	Yes	Yes	Yes
0.039"	Yes	Yes	Yes
0.047"	Yes	Yes	Yes
0.062"	Yes	Yes	Yes
0.078"	Yes	Yes	Yes
0.093"	Yes	Yes	Yes
0.125"	Yes	Yes	Yes
Other	No	Yes	Yes
* not available for multilayer
Aspect Ratio	Limited Review
	<= up to 6.5:1 VP	< 10:1	>10:1
	<= up to 8:1 PCBX
*Aspect ratio = thickness divided by smallest drill size
Layer Count
1- 14 layers	Yes	Yes	Yes
15 - 20 layers	No	Yes*	Yes
> 20 layers	No	No	Yes
* Not Available in 3 oz Finish

Soldermask

MATERIAL TYPE, COPPER WEIGHT AND PCB DESIGN MAY LIMIT TRACE AND SPACE CAPABILITIES

SOLDERMASK	Limited Review	Online NRE	Custom
Material	Liquid photo imageable	Liquid photo imageable	Liquid photo imageable, plus others
Color	Green, blue, black, red, white, yellow, orange, purple, clear	Green, blue, black, red, white, yellow, orange, purple, clear	RFQ for other than green, blue, black, red, white, yellow, orange, purple, clear, plus others
Registration variation	+/- 0.005"	+/- 0.003"	+/- 0.003"
Minimum web	0.004"	0.003"	< 0.003"
Minimum Mask Clearance over pad	Pad size + smallest trace spacing	0.0015" (radius)	0.0015" (radius)
Soldermask artwork requirement	Pad size + smallest board spacing	We will adjust	We will adjust

Silkscreen

MATERIAL TYPE, COPPER WEIGHT AND PCB DESIGN MAY LIMIT TRACE AND SPACE CAPABILITIES

SILKSCREEN	Limited Review	Online NRE	Custom
Silkscreen registration	+/- 0.010"	0.005"	<0.010"
Minimum Character height	0.050"	0.050"	0.050"
Minimum Character width	0.030"	0.030"	0.030"
Minimum Character thickness	0.006"	0.003"	0.003"
Minimum Character spacing	0.005"	0.005"	0.005"

Type	Epoxy Thermal Cure	Epoxy Thermal Cure	Epoxy thermal cure
Color	White, Yellow, Black	White, Yellow, Black	White, yellow, black, Plus Others

Surface Finish

MATERIAL TYPE, COPPER WEIGHT AND PCB DESIGN MAY LIMIT TRACE AND SPACE CAPABILITIES

Surface Finish	Limited Review	Online NRE	Custom
Tin / Lead solder	Yes	Yes	Yes
Immersion silver	Yes*	Yes*	Yes*
ENIG	Yes*	Yes*	Yes*
Copper only	Yes*	Yes*	Yes*
Immersion Tin	No	No	Yes*
OSP	No	No	Yes*
ENIGPIG	No	No	Yes*
Full body hard gold	No	Yes*	Yes*
Soft bondable gold	No	No	Yes*
Lead free solder	No	No	Yes*
* RoHS Compliant Finish
Gold Tips	Limited Review	Online NRE	Custom
Degree Bevel	N/A	15, 30 & 45 degrees	RFQ
Minimum Gold Thickness	N/A	30µ"	RFQ
Minimum Ni Thickness	N/A	100µ"	RFQ

Drill

DRILL	Limited Review	Online NRE	Custom
Drill sizes available	Smallest drill 0.010"	Smallest drill 0.008"	Smallest drill < 0.008"
Positional Tolerance	0.005" radial	0.003" radial	0.003" radial
Hole size variation (post-plate)	+/- 0.005"	+/- 0.003"	+/- 0.003"
NOTE: Hole sizes 0.018" or less may be plugged. Holes > 0.250" will be considered a cutout.
Drilled Hole Capabilities (not finished size)
Smallest drill size	0.010"	0.008"	< 0.008"
Largest drill size	0.250"	0.250"	0.250"
Drilled Slots board thickness 0.062" or less	> = 0.028"	> = 0.020"	> = 0.020"
Drilled Slots board thickness > 0.062"	> = 0.031"	> = 0.031"	> = 0.020"
Note: Hole sizes > 0.250" will be considered a cutout.

Route (Individual)

ROUTE (INDIVIDUAL)	Limited Review	Online NRE	Custom
Variation	+/- 0.010" of board outline layer	+/- 0.005" of board outline layer	< +/-0.005" board outline layer
Router bits board thickness 0.062" or less	0.031"*	0.020"	0.020"
Router bits board thickness >0.062"	0.031"*	0.031"	0.031"
Individual routing	Yes	Yes	Yes
V-score / Jump score	No	Yes	Yes
Tab routing	No	Yes	Yes
Slots	Yes	Yes	Yes
Countersink	No	Yes	Yes
Counterbore	No	No	Yes
Internal cut-outs	Yes	Yes	Yes
Bevel	No	Yes	Yes
Non-plated holes	Yes	Yes	Yes
Maximum board size	12" x 14"	16" x 22"	>16" x 22"
Minimum board dimensions	0.25"	0.25"	< 0.25"
* ValueProto 0.093" router bit only

Route (Tab)

MATERIAL TYPE, COPPER WEIGHT AND PCB DESIGN MAY LIMIT TRACE AND SPACE CAPABILITIES

ROUTE (TAB)	Limited Review	Online NRE	Custom
Space between boards (standard)	N/A	0.100"	0.100"
Route path board perimeter (standard)	N/A	0.093"	0.093"
Border around pallet (standard)	N/A	0.50"	0.50"
Tab width (Standard)	N/A	0.100"	0.100"
Overall panel size	N/A	approx 12" x 14"	approx 12" x 14"
*Note: Panel Approval Prior to manufacturing available

V-Scoring

V-SCORING	Limited Review	Online NRE	Custom
Space between boards	N/A	0.0"	0.0"
Border around pallet	N/A	0.5"	0.5"
Overall panel size	N/A	approx 12" x 14"	approx 12" x 14"
Minimum board size	N/A	0.25" x 0.25"	0.25" x 0.25"
Minimum copper keep-out: Board Thickness < = 0.062"	N/A	0.015" From Route / Cut-Line	<0.025" From Route/Cut-Line
Minimum copper keep-out: Board Thickness > 0.062 "	N/A	0.025" From Route / Cut-Line	<0.25" From Route/Cut-Line


Board size tolerances (route)	+/- 0.010"	+/- 0.005"	< 0.005"

V-score web thickness	N/A	+/-10%	+/-10%
V-score line width	N/A	+/-10%	+/-10%

Plating

MATERIAL TYPE, COPPER WEIGHT AND PCB DESIGN MAY LIMIT TRACE AND SPACE CAPABILITIES

PLATING	Limited Review	Online NRE	Custom
Minimum average Copper in hole	IPC Class II	IPC Class II & III	IPC Class II & III/Other
Minimum plated Copper on surface	IPC Class II	IPC Class II & III	IPC Class II & III/Other

Material

MATERIAL TYPE, COPPER WEIGHT AND PCB DESIGN MAY LIMIT TRACE AND SPACE CAPABILITIES

MATERIAL	Limited Review	Online NRE	Custom
FR-4 Tg rating*	150 or 170 Tg*	150 or 170 Tg	Various
Rogers 3000 series	No	No	Yes
Rogers 4000 series	No	No	Yes
Rogers RT duroid (5000,6000 series)	No	No	Yes
Taconic materials	No	No	Yes
Arlon materials	No	No	Yes
Polyimide	No	No	Yes
Polyfon materials	No	No	Yes
Others	No	No	Yes
*High Tg / Low Td

Other Capabilities

MATERIAL TYPE, COPPER WEIGHT AND PCB DESIGN MAY LIMIT TRACE AND SPACE CAPABILITIES

Other Capabilities	Limited Review	Online NRE	Custom
Controlled Impedance	No	Yes	Yes
Full service CAM tooling	No	Yes	Yes
Design Review for Manufacturability (DFM)	No	Yes	Yes
Film to electronic data conversion	No	No	Yes
Film only orders	No	No	Yes
Cross section lab	No	Yes	Yes
Analytical lab	No	No	Yes
Electrical test	Yes	Yes	Yes
DFMplus	Yes	Yes	Yes

Printed Circuit Board Manufacturing Capabilities

Detailed Printed Circuit Board Assembly Capabilities

Detailed Capabilities

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